GROUP-TEK 网络变压器 HST-24001SCR

Features：

●Compliant with IEEE 802.3ab standard for 1000Base-T.

●Non-PoE Product.

●Support Auto MDIX in 1 pairs of category 5 UTP cable

●Primary inductance(Lp)350uH min.@100KHz,0.1Vrms,DC 8mA

●Capacitance between windings (Cww)30pF Max(at 100kHz, 0.1V).

●Leakage Inductance (LL) 0.6uH Max (at 100kHz, 0.1V).

●DCR Pri 0.9Ω Max Sec 1.2Ω Max.

1.Condition :

1.1 Available for all the through hole parts.

1.2  Soldering Method: IR Reflow.

1.3  Solder:Sn99/Ag0.3/Cu0.7.

1.4  The recommended Lead Free IR Reflow Soldering Curve:

●Balance Inductance (BL) 1.0uH Max (at 100kHz, 0.1V).

●Designed for reflow soldering at temperature 260℃ Max.

●RoHS compliance.

Note 1: All temperatures refer to the center of the package, measured on the package body surface

that is facing up during assembly reflow (e.g., live-bug). Ifparts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), Tp shall be within ± 2 °C of the live-bug Tp and still To accurately measure actual peak package body temperaturesrefer to JEP140 for recommended thermocouple use.meet the Tc requirements, otherwise, the profile shall be adjusted to achieve the latter.

Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to

specify board assembly profiles. Actual board assembly profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 5-2.For example,

if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user.

For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least

30 seconds.For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.

Note 3: All components in the test load shall meet the classification profile requirements.

Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak classification temperature is desired.

2.  Reliability Test Criteria.

2.1 Operating temperature range: 0℃ to +70℃

2.2 Terminal strength: Pull test withstand 9.8N 60+/-0.5S no looseness or movement.

2.3 Solderbility: Dipped in 245℃+/-5℃ molten solder for 3+/-0.5 seconds,95% min shall be smooth any and bright

2.4 Resistance to soldering heat : Convection reflow condition setting: peak temperature at 260℃+0/-5℃

above 217℃ for 60-150 seconds, ramp-up rate 3℃/s. Ramp-down rate 6℃/s Max. No mechanical problem found. No electrical failure found per our specification.

2.5 Vibration: 1.5mm amplitude total excursion 10-55-10 Hz traversed in 1minute, x.y.z, axis for 2 hours. Shall not be any abnormality.

2.6 Random drop (Packing condition): Height 60cm, 3 times on the wood floorboard ,shall not be

any abnormality.

2.7 Dry heat: 100+/-2℃ 96 hours.

2.8 Cold: -20+/-2℃ 96 hours.

2.9 Damp Heat: 60+/-2℃, 93+/-3% RH 96 hours.

2.10 Change of temperature: exposed 5 cycle; each consisting of 30 minutes at -20+/-2℃,2-3 minutes at 20+/-2℃,30 minutes at 85+/-2℃, 2-3 minutes at 20+/-2℃.

Remarks: After reliability test per item 7,8,9,10 in prior to the test as specified, the transformer / coil would be exposed to the room temperature for 1-2 hours,the component meets all requirements according to this specification.